Thermal expansion imaging and finite element simulation of hot lines in high power AlGan HEMT devices

Dietzel, D.; Meckenstock, Ralf; Chotikaprakhan, S.; Bolte, J.; Pelzl, J.; Aubry, R.; Jacquet, J.C.; Cassette, S.:

Eurotherm 75 'Microscale Heat Transfer 2' ; 8-10 July 2003, Reims, France

In: Superlattices and Microstructures, Vol. 35 (2004), No. 3-6, pp. 477 - 484

2004article/chapter in journal

Physics (incl. Astronomy)

Title in English:

Thermal expansion imaging and finite element simulation of hot lines in high power AlGan HEMT devices

Conference

Eurotherm 75 'Microscale Heat Transfer 2' ; 8-10 July 2003, Reims, France

Author:

Dietzel, D.;Meckenstock, Ralf^UDE;Chotikaprakhan, S.;Bolte, J.;Pelzl, J.;Aubry, R.;Jacquet, J.C.;Cassette, S.

Year of publication:

2004

DOI

Language of text:

English

Appears in

Place of publication:

Amsterdam

Publisher:

Elsevier

in:

Vol. 35 (2004), No. 3-6, pp. 477 - 484

ISSN

ISSN

ZDB ID

University bibliography