Kappert, Holger; Dreiner, Stefan; Dittrich, Dirk; Grella, Katharina; Kelberer, Andreas; Klusmann, Miriam; Kordas, Norbert; Kosfeld, Andre; Schmidt, Alexander; Paschen, Uwe; Kokozinski, Rainer:
High temperature 0.35 micron Silicon-on-Insulator CMOS technology
International Conference and Exhibition on High Temperature Electronics 2014 (HiTEC 2014) ; 13 - 15 May 2014, Albuquerque, New Mexico, USA
In: Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) (2014), pp. 254 - 258
2014article/chapter in journal
Materials EngineeringElectrical Engineering and Information TechnologyFaculty of Engineering » Engineering and Information Technology » Elektronische Bauelemente und Schaltungen
Related: 1 publication(s)
Title in English:
High temperature 0.35 micron Silicon-on-Insulator CMOS technology
Conference
International Conference and Exhibition on High Temperature Electronics 2014 (HiTEC 2014) ; 13 - 15 May 2014, Albuquerque, New Mexico, USA
Author:
Kappert, Holger
;Dreiner, Stefan
;Dittrich, Dirk
;Grella, Katharina
;Kelberer, Andreas
;Klusmann, MiriamUDE
LSF ID
10421
Other
connected with university
;Kordas, Norbert
;Kosfeld, Andre
;Schmidt, Alexander
;Paschen, UweUDE
LSF ID
1589
Other
connected with university
;Kokozinski, RainerUDE
GND
173084451
LSF ID
50200
ORCID
0000-0003-3416-3310ORCID iD
Other
connected with university
Year of publication:
2014
DOI
10.4071/HITEC-WA14
Scopus ID
84916241326
Language of text:
English
Appears in
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
Publisher:
IMAPS
in:
pp. 254 - 258
ISSN
2380-4491 Show availability online & print
ZDB ID
2902932-6
Type of resource:
Text